FD-6000 series SMT Glue

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● FD-6011 is a single-component epoxy adhesive that quickly cures after heating. Its shear-thinning viscosity characteristics and low moisture absorption make it very suitable for high-speed SMT screen printing adhesive applying with good and controllable adhesive dot appearance.
● FD-6021 (SMT) is a single-component epoxy adhesive that quickly cures after heating. Its excellent thixotropic performance and air-free state make it very suitable for high-speed SMT surface-mounting machine dispensing, featuring good control over the adhesive dot shape.

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FD-6000 series SMT Glue

● FD-6011 is a single-component epoxy adhesive that quickly cures after heating. Its shear-thinning viscosity characteristics and low moisture absorption make it very suitable for high-speed SMT screen printing adhesive applying with good and controllable adhesive dot appearance.
● FD-6021 (SMT) is a single-component epoxy adhesive that quickly cures after heating. Its excellent thixotropic performance and air-free state make it very suitable for high-speed SMT surface-mounting machine dispensing, featuring good control over the adhesive dot shape.

Classification:

Bonding and Fixing Adhesive

  • Description

    Typical Use:
    Before wave peak soldering, this product can be used to affix surface mounted components on the printed circuit board. The low moisture absorption of FD-6011 allows it to be exposed in open adhesive tank for a longer period of time without affecting the adhesive application performance or causing holes in the cured adhesive
    FD-6021 (SMT) is particularly suitable for medium/high speed dispensing, with high adhesive dot shape, high strength, and good electrical performance

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