Sn-Ag-Cu system alloy lead-free and no-clean solder paste
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● The product is fully independently developed based on technology platforms of Europe, America and Japan
● Innovative research and development capabilities meet the growing demand for SMT processes
● Brand new rosin resin composite antioxidation technology features stable performance and appropriate adhesion
● The product features good wettability with a drying resistance time of over 48 hours, and can effectively maintain adhesion
● The product features good printing rolling and demolding performance, and is capable of printing components with a spacing of 0.3mm or more, with minimal viscosity changes during continuous printing
● The solder joints are flat, full, and shiny
● Innovative research and development capabilities meet the growing demand for SMT processes
● Brand new rosin resin composite antioxidation technology features stable performance and appropriate adhesion
● The product features good wettability with a drying resistance time of over 48 hours, and can effectively maintain adhesion
● The product features good printing rolling and demolding performance, and is capable of printing components with a spacing of 0.3mm or more, with minimal viscosity changes during continuous printing
● The solder joints are flat, full, and shiny
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隐藏域元素占位
Sn-Ag-Cu system alloy lead-free and no-clean solder paste
● The product is fully independently developed based on technology platforms of Europe, America and Japan
● Innovative research and development capabilities meet the growing demand for SMT processes
● Brand new rosin resin composite antioxidation technology features stable performance and appropriate adhesion
● The product features good wettability with a drying resistance time of over 48 hours, and can effectively maintain adhesion
● The product features good printing rolling and demolding performance, and is capable of printing components with a spacing of 0.3mm or more, with minimal viscosity changes during continuous printing
● The solder joints are flat, full, and shiny
● Innovative research and development capabilities meet the growing demand for SMT processes
● Brand new rosin resin composite antioxidation technology features stable performance and appropriate adhesion
● The product features good wettability with a drying resistance time of over 48 hours, and can effectively maintain adhesion
● The product features good printing rolling and demolding performance, and is capable of printing components with a spacing of 0.3mm or more, with minimal viscosity changes during continuous printing
● The solder joints are flat, full, and shiny
Classification:
Solder Paste
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