Sn-Pb system alloy series tin-lead solder bar

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● High-purity electrolytic tin and lead are selected as raw materials of Sn-Pb system alloy solder
● The product is casted by adopting the advanced melting process to remove several harmful impurities and gases dissolved in it, and complies with GB8012-2000 standard
● Oxidation-resistant alloy is added to all solder bars, and the operating temperature is below 300°C. The solder liquid surface is bright with very little oxidation slag, making it suitable for any form of hot-dip soldering and wave peak soldering
● The product features good wettability and solderability, bright solder joints, and very few poor soldering phenomena

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Sn-Pb system alloy series tin-lead solder bar

● High-purity electrolytic tin and lead are selected as raw materials of Sn-Pb system alloy solder
● The product is casted by adopting the advanced melting process to remove several harmful impurities and gases dissolved in it, and complies with GB8012-2000 standard
● Oxidation-resistant alloy is added to all solder bars, and the operating temperature is below 300°C. The solder liquid surface is bright with very little oxidation slag, making it suitable for any form of hot-dip soldering and wave peak soldering
● The product features good wettability and solderability, bright solder joints, and very few poor soldering phenomena

Classification:

Solder Bar

  • Description

    Tin-lead Solder Rod

    Alloy composition

    Sn63Pb37

    Sn60Pb40

    Density (g/cm³)

    8.4

    8.5

    Melting point (℃)

    183

    183-190

    Working temperature (℃)

    220-240

    250-260

    Application

    Computer, Precision instruments, Television, Micromation technology, Coated metals

     

    Alloy composition

    Sn55Pb45

    Sn50Pb50

    Sn45Pb55

    Density (g/cm³)

    8.7

    8.9

    9.1

    Melting point (℃)

    183-203

    183-215

    183-221

    Working temperature (℃)

    260-280

    280-300

    280-320

    Application

    Calculator, Telephone, Quartz clock and other common electronics and electrical appliances

     

    Alloy composition

    Sn40Pb60

    Sn30Pb70

    Density (g/cm³)

    9.3

    9.7

    Melting point (℃)

    185-235

    185-255

    Working temperature (℃)

    295-325

    305-340

    Application

    General circuit boards, Toys, Light bulbs, Handicrafts, Etc.

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