Sn-Pb/Sn-Pb-Ag system alloy no-clean solder paste
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● Tailor-made flux ensures high reliability and excellent wettability
● After reflux, there is very little residue, and the product has excellent no-clean and cleaning performance
● Flux can effectively prevent collapse during printing and preheating
● The product complies with the American Joint Standard ANSI/J-STD-004 ROL0 type flux
● The product features long lasting adhesion, and the effective working life is over 8 hours
● The residue is colorless and transparent, and does not affect testing
● After reflux, there is very little residue, and the product has excellent no-clean and cleaning performance
● Flux can effectively prevent collapse during printing and preheating
● The product complies with the American Joint Standard ANSI/J-STD-004 ROL0 type flux
● The product features long lasting adhesion, and the effective working life is over 8 hours
● The residue is colorless and transparent, and does not affect testing
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Sn-Pb/Sn-Pb-Ag system alloy no-clean solder paste
● Tailor-made flux ensures high reliability and excellent wettability
● After reflux, there is very little residue, and the product has excellent no-clean and cleaning performance
● Flux can effectively prevent collapse during printing and preheating
● The product complies with the American Joint Standard ANSI/J-STD-004 ROL0 type flux
● The product features long lasting adhesion, and the effective working life is over 8 hours
● The residue is colorless and transparent, and does not affect testing
● After reflux, there is very little residue, and the product has excellent no-clean and cleaning performance
● Flux can effectively prevent collapse during printing and preheating
● The product complies with the American Joint Standard ANSI/J-STD-004 ROL0 type flux
● The product features long lasting adhesion, and the effective working life is over 8 hours
● The residue is colorless and transparent, and does not affect testing
Classification:
Solder Paste
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