FD503-H7 organosilicone sealant
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FD503-H7 organosilicone sealant is a two-component addition type organosilicone material cured at room temperature or after hearting. This two-component elastic silicone sealant is designed for potting and protecting electronic products under harsh conditions. The formula adopts a new technology so that the product cures well at room temperature. After thoroughly and evenly mixing components A and B as per 1:1 weight ratio, the product cures into an elastic material within a certain period of time.
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FD503-H7 organosilicone sealant
FD503-H7 organosilicone sealant is a two-component addition type organosilicone material cured at room temperature or after hearting. This two-component elastic silicone sealant is designed for potting and protecting electronic products under harsh conditions. The formula adopts a new technology so that the product cures well at room temperature. After thoroughly and evenly mixing components A and B as per 1:1 weight ratio, the product cures into an elastic material within a certain period of time.
Classification:
Organosilicone Sealant
- Description
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I. Product characteristics
1. Two-component addition type, solvent-free, no curing by-products
2. Resistance to moisture, dirt and other atmospheric components
3. High strength, good adhesion, and good adhesion to many metals such as aluminum, copper, stainless steel, etc.
4. Reduction of mechanical stress and tension caused by mechanical/thermal shock, and vibration
II. Typical data parametersAll the above data is measured after curing at 25℃ and 55% RH for 7 days.
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