FD503-H7 organosilicone sealant

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FD503-H7 organosilicone sealant is a two-component addition type organosilicone material cured at room temperature or after hearting. This two-component elastic silicone sealant is designed for potting and protecting electronic products under harsh conditions. The formula adopts a new technology so that the product cures well at room temperature. After thoroughly and evenly mixing components A and B as per 1:1 weight ratio, the product cures into an elastic material within a certain period of time.

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FD503-H7 organosilicone sealant

FD503-H7 organosilicone sealant is a two-component addition type organosilicone material cured at room temperature or after hearting. This two-component elastic silicone sealant is designed for potting and protecting electronic products under harsh conditions. The formula adopts a new technology so that the product cures well at room temperature. After thoroughly and evenly mixing components A and B as per 1:1 weight ratio, the product cures into an elastic material within a certain period of time.

Classification:

Organosilicone Sealant

  • Description

    I. Product characteristics
    1. Two-component addition type, solvent-free, no curing by-products
    2. Resistance to moisture, dirt and other atmospheric components
    3. High strength, good adhesion, and good adhesion to many metals such as aluminum, copper, stainless steel, etc.
    4. Reduction of mechanical stress and tension caused by mechanical/thermal shock, and vibration


    II. Typical data parameters

    State

    Item

    Component A

    Component B

     

     

    Before Curing

    Appearance

    Colorless transparent liquid

    Colorless transparent liquid

    Viscosity mPa.s (25℃) 

    50-300

    50-300

    Specific gravity (g/cm3) 

    1.0±0.05

    1.0±0.05

    Viscosity after mixing (mass 1:1)

    50-300

    Curing time/h (@25±2C) 

    3

     

     

    After Curing

    Appearance

    Colorless and transparent elastomer

    Hardness (Shore 00) 

    0

    Expansion coefficient μm/ (m, ℃) 

    200

    Volume resistivity (Ω.cm)

    ≥3.0 × 1013

    Dielectric constant (1.0MHz) 

    3.34

    Dielectric loss coefficient (1.0MHz) 

    0.0067

    Breakdown voltage kV/mm (25℃) 

    20

    All the above data is measured after curing at 25℃ and 55% RH for 7 days.

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