FD503-TG series organosilicone potting adhesive

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● FD503-TG series is an AB two-component thermal conducting potting adhesive product prepared using high thermal conductivity material as the thermal conducting medium and vinyl silicone oil as the base material
● High coefficient of thermal conductivity and good insulation
● Good storage stability and low settlement degree
● Excellent aging resistance and good adhesion to materials such as metal

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隐藏域元素占位

FD503-TG series organosilicone potting adhesive

● FD503-TG series is an AB two-component thermal conducting potting adhesive product prepared using high thermal conductivity material as the thermal conducting medium and vinyl silicone oil as the base material
● High coefficient of thermal conductivity and good insulation
● Good storage stability and low settlement degree
● Excellent aging resistance and good adhesion to materials such as metal

Classification:

Thermal Conducting Potting Adhesive

  • Description

    I. Typical Use
    Potting and heat dissipation protection of power supply module
    Potting and heat dissipation protection of electronic components


    II. Technical parameters

    Performance indicators

    FD503-TG10

    FD503-TG20

    FD503-TG101

    FD503-TG102

     

    Component A

    Component B

    Component A

    Component B

    Component A

    Component B

    Component A

    Component B

     

    Before Curing

    Appearance

    White fluid

    Black fluid

    White fluid

    Gray fluid

    White fluid

    Gray fluid

    White fluid

    Black fluid

    Viscosity (cps)

    ≦8000

    ≦8000

    12000

    12000

    ≦8000

    ≦8000

    ≦1000 

    ≦1000 

    Mixing ratio A: B (weight ratio)

    1 ∶ 1

    1 ∶ 1

    1 ∶ 1

    1 ∶ 1

    Viscosity after mixing (cps)

    ≦8000

    12000

    ≦8000

    ≦1000 

    Room temperature applicable time (min)

    30

    30

    -

    30

    Molding time (h) at room temperature (T)

    8

    4

    -

    ≦5 

    Curing time (h) at room temperature (@ 25C)

    -

    -

    ≤5

    -

    After Curing

    Hardness (Shore 00)

    31

    31

    50

    10

    Coefficient of thermal conductivity (W/m·k)

    1.0±0.2

    2.0±0.2

    1.0±0.2

    0.6±0.2

    Dielectric strength (kV/mm)

    ≥18

    ≥18

    ≥18

    ≥18

    Dielectric constant (1.0MHz)

    2.8

    2.8

    2.6-3.1

    2.7

    Volume resistivity (Ω.cm)

    ≥1.0×1013

    ≥1.0×1013

    ≥1.0×1013

    ≥1.0×1013

    Specific gravity

    1.75±0.05

    2.80±0.10

    1.70±0.05

    1.65±0.05

    The above performance data before curing is measured under conditions of 25℃ and relative humidity of 55%. The mechanical and electrical performance data is measured after the specimen was completely cured. Our company shall not assume any responsibility for data differences caused by different testing conditions or product improvements.

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