FD503-TG series organosilicone potting adhesive
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● High coefficient of thermal conductivity and good insulation
● Good storage stability and low settlement degree
● Excellent aging resistance and good adhesion to materials such as metal
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隐藏域元素占位
FD503-TG series organosilicone potting adhesive
● High coefficient of thermal conductivity and good insulation
● Good storage stability and low settlement degree
● Excellent aging resistance and good adhesion to materials such as metal
Classification:
Thermal Conducting Potting Adhesive
- Description
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I. Typical Use
Potting and heat dissipation protection of power supply module
Potting and heat dissipation protection of electronic components
II. Technical parametersThe above performance data before curing is measured under conditions of 25℃ and relative humidity of 55%. The mechanical and electrical performance data is measured after the specimen was completely cured. Our company shall not assume any responsibility for data differences caused by different testing conditions or product improvements.
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