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Sn-Ag-Cu system alloy lead-free and no-clean solder paste

● The product is fully independently developed based on technology platforms of Europe, America and Japan
● Innovative research and development capabilities meet the growing demand for SMT processes
● Brand new rosin resin composite antioxidation technology features stable performance and appropriate adhesion
● The product features good wettability with a drying resistance time of over 48 hours, and can effectively maintain adhesion
● The product features good printing rolling and demolding performance, and is capable of printing components with a spacing of 0.3mm or more, with minimal viscosity changes during continuous printing
● The solder joints are flat, full, and shiny

Sn-Bi/Sn-Bi-Ag system alloy SMT low-temperature soldering/heat sink special solder paste

Details

Sn-Pb/Sn-Pb-Ag system alloy no-clean solder paste

Details

● Tailor-made flux ensures high reliability and excellent wettability
● After reflux, there is very little residue, and the product has excellent no-clean and cleaning performance
● Flux can effectively prevent collapse during printing and preheating
● The product complies with the American Joint Standard ANSI/J-STD-004 ROL0 type flux
● The product features long lasting adhesion, and the effective working life is over 8 hours
● The residue is colorless and transparent, and does not affect testing

Sn-Cu/Sn-Ag-Cu system alloy lead-free solder wire

Details

● Sn-Cu/Sn-Ag-Cu system alloy solder is refined with the new casting process and high-purity raw materials, and is used for manual soldering with soldering iron as per strict environmental requirements
● The product adopts a scientific flux formula, and features good fluidity, low smoke, and minimal splashing, etc.

Sn-Pb system alloy tin-lead solder wire

Details

● Sn-Pb system alloy solder wire has a complete variety and stable quality
● Tin-lead solder wire in line with national standards is produced with the new die-casting process
● The solder joints are bright and easily tin-coated
● During soldering, there is no splashing, with low smoke and odor
● The flux distribution is uniform and there is no broken rosin phenomenon
● The winding is uniform and neat, and solder wires with various alloys and rosin contents can be produced according to customer requirements

Sn-Cu/Sn-Ag-Cu system alloy lead-free solder bar

Details

● Sn-Cu/Sn-Ag-Cu system alloy solder is made of high-purity raw materials and is produced according to the new casting process requirements
● The oxides formed in metal raw materials are effectively removed, further improving the oxidation resistance of tin bar
● The product fully complies with the quality requirements of RoHS and SS-00259
● The product features good wettability, good solderability, few impurities, and good diffusive force
● The product is suitable for various wave peak soldering and manual soldering with high quality and environmental protection requirements, improving production speed and reducing production costs

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Contact Information

Tel:

+86-(0)512-6535 6985
+86-(0)512-6535 6987
+86-(0)512-6535 6989

Fax:

+86-(0)512-6535 6986

Email:

costar@szcostar.com

Address:

No. 525 Zhujiang Road, Suzhou City, Jiangsu Province, China

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